MULTI-FUNCTIONAL WIRE BONDER（Ball & Wedge）
S450-BW
FEATURES：
1. Close loop force control
2. EFO controlled by CPLD
3. DSP phase lock, stable ultrasonic output
4. Drive by electricity without compressed air
5. Self-study Chinese GUl for advanced process
6. Unique tailless bumping process and super adaptability for soft substrates
TECHNICAL SPECIFICATION
| Bond Wire | Au(15~75um),Pt(18~25μm),Ag(18~50μm),Al(18~100μm) |
|---|---|
| Device Depth | Ball Bonding Max:15mm,Wedge Bonding Max:21mm |
| Type of Bonding Tools | 16mm Ball Bonding Tools； 19mm,25mm Wedge Bonding Tools |
| Spool | Standard :1/2 inch；Optional : 2 inch |
| Bond Force | 1~250g |
| Bond Power | Numerical control,1000x subdivision |
| Clamping Table | Maximum Temperature 200℃ |
| Bond Head Z Range | 18mm |
|---|---|
| Bond Head X-Y Range | X=15mm,Y=15mm |
| Lifting Table Z Range | 0~18mm |
| Lifting Table X-Y Range | 250mm×270mm |
| Input Voltage | 220V±10%@50~60Hz |
| Power Consumption | ≤500W |
| Weight | GW.≈47kg,NW.≈70kg |
| Footprint | ≤620mm x 640mm x 450mm(W x D x H) |