FULLY AUTOMATIC DEEP ACCESS WIRE BONDER（BALL）
ZH6000-B
Product Features
- Large bonding working area
- Fixed-length & fixed-height loop control function
- Piezoelectric ultrasonic motor tail wire control mechanism
- Compatible with 16 mm and 19 mm capillaries
- Real-time BMS bonding spot inspection
- Real-time deformation monitoring
- Real-time ultrasonic energy monitoring
Performance Upgrades
- Support for various loop profiles
- Patented high-precision image scanning technology
- Compatible with multiple material feeding systems
- New-generation intelligent graphical operating system
TECHNICAL SPECIFICATION
| Application Scope | Discrete devices, microwave components, lasers, optical communication devices, sensors, MEMS, SAW devices, RF modules, power devices, etc. |
|---|---|
| Bonding Accuracy | ±3 μm @ 3sigma |
| Bonding Working Area | X-axis: 305 mm, Y-axis: 457 mm, rotation range: 0~180° |
| Ultrasonic Power Range | 0~4 W precise control with stepped flexible energy output |
| Loop Control | Fully programmable |
| Maximum Cavity Depth | 12 mm |
| Bonding Materials | Gold wire (18–75 μm), copper wire (18–75 μm), selected alloy wires |
|---|---|
| Bond Force | 0–220 g |
| Capillary Length Options | 16 mm, 19 mm |
| Bonding Speed | ≥5 wires per second |
| Operating System | Windows |
| Equipment Net Weight | 1.2 T |
FACILITY REQUIREMENT
| Power Input | 220V±10%@50~60Hz |
|---|---|
| Power Consumption | 2KW |
| Air Pressure | ≥0.35MPa |
|---|---|
| Footprint | ≤1000mm x 1500mm x 1700mm(W x D x H) |