S450-BW-Multi-functional wire bonder
MULTI-FUNCTIONAL WIRE BONDER(Ball & Wedge)

S450-BW

FEATURES:

1. Close loop force control
2. EFO controlled by CPLD
3. DSP phase lock, stable ultrasonic output
4. Drive by electricity without compressed air
5.  Self-study Chinese GUl for advanced process
6.  Unique tailless bumping process and super adaptability for soft substrates

TECHNICAL SPECIFICATION

Bond WireAu(15~75um),Pt(18~25μm),Ag(18~50μm),Al(18~100μm)
Device DepthBall Bonding Max:15mm,Wedge Bonding Max:21mm
Type of Bonding Tools16mm Ball Bonding Tools; 19mm,25mm Wedge Bonding Tools
SpoolStandard :1/2 inch;Optional : 2 inch
Bond Force1~250g
Bond PowerNumerical control,1000x subdivision
Clamping TableMaximum Temperature 200℃
Bond Head Z Range18mm
Bond Head X-Y RangeX=15mm,Y=15mm
Lifting Table Z Range0~18mm
Lifting Table X-Y Range250mm×270mm
Input Voltage220V±10%@50~60Hz
Power Consumption≤500W
WeightGW.≈47kg,NW.≈70kg
Footprint≤620mm x 640mm x 450mm(W x D x H)