MULTI-FUNCTIONAL WIRE BONDER(Ball & Wedge)
S450-BW
FEATURES:
1. Close loop force control
2. EFO controlled by CPLD
3. DSP phase lock, stable ultrasonic output
4. Drive by electricity without compressed air
5. Self-study Chinese GUl for advanced process
6. Unique tailless bumping process and super adaptability for soft substrates
TECHNICAL SPECIFICATION
Bond Wire | Au(15~75um),Pt(18~25μm),Ag(18~50μm),Al(18~100μm) |
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Device Depth | Ball Bonding Max:15mm,Wedge Bonding Max:21mm |
Type of Bonding Tools | 16mm Ball Bonding Tools; 19mm,25mm Wedge Bonding Tools |
Spool | Standard :1/2 inch;Optional : 2 inch |
Bond Force | 1~250g |
Bond Power | Numerical control,1000x subdivision |
Clamping Table | Maximum Temperature 200℃ |
Bond Head Z Range | 18mm |
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Bond Head X-Y Range | X=15mm,Y=15mm |
Lifting Table Z Range | 0~18mm |
Lifting Table X-Y Range | 250mm×270mm |
Input Voltage | 220V±10%@50~60Hz |
Power Consumption | ≤500W |
Weight | GW.≈47kg,NW.≈70kg |
Footprint | ≤620mm x 640mm x 450mm(W x D x H) |