ZH6000-W
FULLY AUTOMATIC DEEP ACCESS WIRE BONDER(WEDGE)

ZH6000-W

Product Features

  • Large welding working range
  • Real-time deformation monitoring
  • Real-time ultrasonic energy monitoring
  • Piezoelectric ultrasonic motor tail wire control mechanism
  • Compatible with 19mm and 25mm capillaries
  • Fixed-length & fixed-height loop control capability
  • HD vision assistant tool for bonder head maintenance

Performance Upgrades

  • Diverse loop profile support
  • Patented high-precision image scanning technology
  • Compatibility with various material feeding systems
  • New-generation intelligent graphic operating system

TECHNICAL SPECIFICATION

Application ScopeDiscrete devices, microwave components, lasers, optical communication devices, sensors, MEMS, SAW devices, RF modules, power devices, etc.
Bonding Accuracy±3μm @ 3sigma
Bonding Working AreaX-axis: 305 mm, Y-axis: 457 mm, rotation range: ±220°
Ultrasonic Output Range0~4 W with precise control and stepped flexible energy application
Loop ControlFully programmable
Maximum Cavity Depth16 mm
Bonding Wires & RibbonsGold wire (18~75 μm), aluminum wire (18~75 μm), gold ribbon (12.7×50 μm ~ 25.4×300 μm), partial alloy wires
Bond Force0~220 g
Capillary Length Options19 mm, 25 mm
Bonding Speed≥5 wires per second
Operating SystemWindows
Net Weight of Equipment1.2 T

FACILITY REQUIREMENT

Power Input220V±10%@50~60Hz
Power Consumption2KW
Air Pressure≥0.35MPa
Footprint≤1000mm x 1500mm x 1700mm(W x D x H)