MULTI-FUNCTIONAL WIRE BONDER(WEDGE)
S450-W
FEATURES：
1. High precision close loop force control
2. DSP phase lock,stable ultrasonic output
3. Excellent fine wire control and super adaptability for soft substrates
4. Self-study Chinese GUl for advanced process
5. Drive by electricity without compressed air
TECHNICAL SPECIFICATION
| Bond Wire | Au(15~75μm),Al(18~100μm),Alloy wire（18~25μm） |
|---|---|
| Device Depth | Max:21mm |
| Type of Bonding Tools | 19mm,25mm |
| Spool | Standard :1/2 inch；Optional : 2 inch |
| Bond Force | 1~250g |
| Bond Power | Numerical control,1000x subdivision |
| Clamping Table | Maximum Temperature 200℃ |
| Bond Head Z Range | 18mm |
|---|---|
| Bond Head X-Y Range | X=15mm,Y=15mm |
| Lifting Table Z Range | 0~18mm |
| Lifting Table X-Y Range | 250mm×270mm |
| Input Voltage | 220V±10%@50~60Hz |
| Power Consumption | ≤500W |
| Weight | GW.≈47kg,NW.≈70kg |
| Footprint | ≤620mm x 640mm x 450mm(W x D x H) |