High Accuracy Wafer Level Epoxy Die Attach
AP0300WE
Product Features：
- Fast & High-Precision Horizontal Rotary Head
- Wafer Mapping Function
- Dual-Field Vision System with Low & High Magnification
- Supports Flexible Multi-Reference Die Attach
- Real-Time Vision Center Calibration
- 3D Stacking Function with Max Stack Height up to 5 mm
- Integrated Inline Contact Height Measurement, Supports Dispensing Needle Height Detection
- Flexible Process Flow, Free Combination of Working Procedures, Single Procedure Disable Available
- Multiple PR Recognition Modes (Template Matching, Edge Positioning, Reference Pattern Positioning, Geometric Center Positioning, etc.)
- Various Standard Pre-set Dispensing Patterns, Custom Patterns & Pattern Overlay Supported
- Class 100 Cleanroom Standard (Optional)
TECHNICAL SPECIFICATION
| Force Control Accuracy | ±2 g |
|---|---|
| Position Accuracy | ±3 μm @ 3sigma |
| Angle Accuracy | ±0.15° @ 3sigma |
| Height Measurement Accuracy | ±1 μm |
| Travel Range | X=360 mm, Y=657 mm, Z=30 mm |
| Wafer Size | 8-inch, compatible with 4-inch & 6-inch |
| Die Size | Min 0.2 mm × 0.2 mm, Max 15 mm × 15 mm |
| Wafer Gel Pack Size | 2-inch |
| Quantity of Wafer Gel Packs | 20 pcs, expandable to 30 pcs |
| Nozzle Quantity | 12 (with height measurement function) |
|---|---|
| Height Measurement Method | Contact Type |
| Dispensing Valve | Musashi Precision Pneumatic Control Valve SUPER ΣCMIII |
| Adhesive Type | Epoxy |
| Syringe Size | 3 cc, 5 cc, 10 cc |
| Min Dot Diameter | ∅0.25 mm |
| Bonding Force | 15 ~ 500 g |
| UPH (Units Per Hour) | 1200 (Die Attach Only) |
| Operating System | Windows |
Installation Requirements
| Input Voltage | 220V±10%@50/60Hz |
|---|---|
| Rated Power | 1KW |
| Overall Dimension | 1300 mm × 1570 mm × 1900 mm (W × D × H) |
| Compressed Air Requirement | 0.4 ~ 0.6 MPa |
|---|---|
| Vacuum Line Pressure | ≤ -85kPa |
| Net Weight | 1.35 T |