X1
High Accuracy Wafer Level Epoxy Die Attach

AP0300WE

FEATURES:

1. 3D stacking up to 5mm
2. Class 100 Cleanroom (Optional)
3. Wafer Mapping system
4. Real time correction of visual center
5. Flexible multi reference patch
6. High accuracy wafer level packaging
7. Integrated online contact height measurement
8. High and low magnification dual field vision system
9. High-speed and high-precision Dual driven Gantry System
10. Expandable for traditional Die attach(C2S), and Die sorting
11. High precision Pre-Pattern and flexible dispensing,support overlay of dispensing patterns

TECHNICAL SPECIFICATION

Positioning Accuracy±3μm@3sigma
Angular Accuracy±0.15°
Height Measurement Accuracy±1μm
Force Control Accuracy±1g
StrokeX=360mm ,Y=657mm, Z= 30mm
Die SizeMin. 0.38mm x 0.38mm,Max. 7mm x 7mm
Waffle Pack/Gel-Pak size2 inches
Waffle Pack/Gel-Pak Quantity20x,Max 30x(Optional)
Nozzle Quantity12(Including height measurement)
Height Measurement MethodContact Measurement
Adhesive TypeEpoxy
Epoxy Volume3cc、5cc、10cc
Minimum adhesive spot diameter∅0.3mm
Bonding Force10~200g
Operating SystemWindows
Weight1.6T

FACILITY REQUIREMENT

Power Input220V±10%@50/60Hz
Power Consumption2KW
Footprint970mm x 1570mm x 2040mm (W x D x H)
Air Pressure0.4 ~ 0.6MPa
Vacuum Pressure≤ -85kPa

MORE PRODUCTS