High-Precision Dispensing & Die Attach Integrated Machine DA0300SE

DA0300SE

Product Features：

Supports Flexible Multi-Reference Die Attach
High-Precision Force Control with Accuracy ±2 g
Transfer Stage Auxiliary High-Precision Positioning (Optional)
Top & Bottom Vision High-Precision Positioning Function
Inline Production, Worktable Mode Optional
Fast & High-Precision Horizontal Rotary Head
Flexible Process Flow, Free Combination of Working Procedures, Single Procedure Disable Available
Integrated Inline Contact Height Measurement, Supports Dispensing Needle Height Detection
Various Standard Pre-set Dispensing Patterns, Custom Patterns & Pattern Overlay Supported (Optional)
Multiple PR Recognition Modes (Template Matching, Edge Positioning, Reference Pattern Positioning, Geometric Center Positioning, etc.)

TECHNICAL SPECIFICATION


Position Accuracy	±3 μm @ 3sigma
Angle Accuracy	±0.15° @ 3sigma
Height Measurement Accuracy	±1μm
Force Control Accuracy	±2g
Travel Range	X=386 mm, Y=716 mm, Z=50 mm
Die Size	Min 0.2 mm × 0.2 mm, Max 15 mm × 15 mm
Waffle Pack/Gel-Pak size	2-inch, compatible with 4-inch
Waffle Pack/Gel-Pak Quantity	30 pcs of 2-inch OR 22 pcs of 2-inch + 2 pcs of 4-inch
Max Cavity Depth	15 mm


Nozzle Quantity	12 (with height measurement function)
Height Measurement Method	Contact Measurement
Dispensing Valve	Musashi Precision Pneumatic Control Valve SUPER ΣCMIII
Adhesive Type	Epoxy
Epoxy Volume	3cc、5cc、10cc
Minimum adhesive spot diameter	∅0.25mm
Bonding Force	15~500g
UPH	1200 (Die Attach Only)
Operating System	Windows