High-Precision Die Attacher
DA0300S
Product Features：
- Supports Flexible Multi-Reference Die Attach
- Multi-Die Mounting, User-Friendly Programming
- Integrated Inline Contact Height Measurement
- High-Precision Force Control with Accuracy ±1 g
- Inline Production, Worktable Mode Optional
- Top & Bottom Vision High-Precision Positioning Function
- Transfer Stage Auxiliary High-Precision Positioning (Optional)
- Fast & High-Precision Horizontal Rotary Head
- Flexible Process Flow, Free Combination of Working Procedures, Single Procedure Disable Available
- Multiple PR Recognition Modes (Template Matching, Edge Positioning, Reference Pattern Positioning, Geometric Center Positioning, etc.)
TECHNICAL SPECIFICATION
| Position Accuracy | ±3 μm @ 3sigma |
|---|---|
| Angle Accuracy | ±0.15° @ 3sigma |
| Height Measurement Accuracy | ±1 μm |
| Die Size | Min 0.2 mm × 0.2 mm, Max 15 mm × 15 mm |
| Wafer Gel Pack Size | 2-inch, compatible with 4-inch |
| Quantity of Wafer Gel Packs | 22 pcs of 2-inch + 2 pcs of 4-inch OR 30 pcs of 2-inch |
| Nozzle Quantity | 12 |
| Travel Range | X=386 mm, Y=716 mm, Z=50 mm |
|---|---|
| Max Cavity Depth | 15 mm |
| Height Measurement Method | Contact Type |
| Bonding Force | 15 ~ 500 g |
| Force Control Accuracy | ±2 g |
| UPH | 1200 |
| Operating System | Windows 10 |
FACILITY REQUIREMENT
| Input Voltage | 220V±10%@50/60Hz |
|---|---|
| Rated Power | 1KW |
| Overall Dimension | 970 mm × 1570 mm × 2040 mm (W × D × H) |
| Compressed Air Requirement | 0.4~0.6 MPa |
|---|---|
| Vacuum Line Pressure | ≤ -85kPa |
| Equipment Net Weight | 1.3 T |